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Graphite Plate for AlSiC IGBT Plate

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An equivalent sized heat pipe embedded AlSiC plate has ... Similarly to the graphite ... et al., “Al-SiC Improves reliability of IGBT Power Modules ...

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AlSiC - Wikipedia

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A three-dimensional TLM simulation method for thermal ...

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Advanced Thermal Control Enabling Cost Reduction …

Advanced Thermal Control Enabling Cost Reduction for Automotive Power Electronics ... AlSiC Cu-Mo is a candidate base plate material ...

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A simple method to estimate heat sink air flow bypass : Robert E. Simons, Electronics Cooling ... around the sides of a parallel plate fin heat sink.

Heat Dissipation and Thermal Resistance in Power …

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ACTIVE POWER CYCLING TEST - Fraunhofer IISB

3 Graphite as base plate material 4 IGBT on heatspreader during power cycling test ... matched to low CTE base plate materials such as AlSiC or AlN insulating substrates[PDF]

Transient 3D Heat Flow Analysis for High Power Insulated ...

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Patent US20080079021 - Arrangement for cooling a power ...

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100A IGBT module with the plastic lid removed. ... The base of this module is a metal plate that acts as a ... (AlSiC), copper graphite metal matrix composites, ...[PDF]

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Heat dissipation, thermal stresses, warping and in some cases weight, are increasingly critical issues in packaging of microelectronic and photonic

Patent US7755185 - Arrangement for cooling a power ...

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AlSiC - WikiVisually

AlSiC-9, containing 37 vol ... the Insulated-gate bipolar transistor was developed in the 1980s, ... for example rolled plate, ...

Diamond pins utilized as thermal vias for high heat flux ...

and Substrates for Semiconductor Packaging. David L. Saums, ... graphite wafer within an AlSiC cast ... Metal-based thermal interface materials for large IGBT ...

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LIGHTING JAPAN - jan2012.tems-system

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Arrangement for cooling a power semiconductor module ...

Jul 13, 2010· An arrangement for cooling a power semiconductor ... An arrangement for cooling a power semiconductor module, ... of an Aluminum-Graphite MMC (AlC) plate ...Authors: Reinhold Bayerer · Thomas LichtAffiliation: Infineon Technologies

Heat pipe and thermal management glossary, Thermacore

Heat pipe and thermal management glossary, ... Cold Plate A plate used to ... Insulated Gate Bipolar Transistor.

Patent US7786486 - Double-sided package for power …

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PROCESSING AND CHARACTERIZATION OF MODULE …

PROCESSING AND CHARACTERIZATION OF MODULE TO HEATSPREADER INTERFACE ... insulated gate bipolar transistors (IGBT) and solid state lasers) in Figure 4.1.1.

PPT - "AlSiC-Based Hybrid Composite Tool Kit" ...

"AlSiC-Based Hybrid Composite Tool Kit". By Richard W. Adams and Mark A. Occhionero Ceramics Process Systems 111 South Worcester St Chartley MA 02712-0338 ...

Copper-covered ALSiC composite radiating substrate and ...

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Arrangement for cooling a power semiconductor module

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Arrangement for cooling a power semiconductor module

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Silicon carbide - Revolvy

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Heat pipe and thermal management glossary, Thermacore

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Tile Specialties, Inc - Supplier of ceramic, ceramic tile ...

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Patent US20070057284 - Double-sided package for power ...

The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material.

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Our primary product is silicon-carbide reinforced aluminum (AlSiC), which is used to make microprocessor lids, heat sinks and IGBT baseplates ...

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Patent US6921969 - Semiconductor module and method of ...

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Patent US7017651 - Method and apparatus for temperature ...

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Dome Shaped Surface of AlSiC IGBT Base Plate

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AlSiC Baseplates for Power IGBT Modules_百度文库

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The Emerging Electrical Markets for Copper

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Patent US8218320 - Heat sinks with C-shaped manifolds and ...

A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material.

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A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material.

Research Projects – FraunhoferJ_LEAPT at DICMAPI UniNa

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Proposal for a Council Regulation suspending the ...

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Patent US6250127 - Heat-dissipating aluminum silicon ...

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